微电路用水基氧化铜组合物

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI:10.1109/IEMT.1993.639752

C. Wang, Y. Yokotani, T. Ogawa

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引用次数: 0

摘要

从环境保护的角度出发，利用水作为溶剂代替电子材料中的有机物是一种理想的选择，开发了氧化铜组合物和混合电路制造工艺。这些糊状物显示出大量的有机含量降低，同时保留了典型的有机基铜糊状物的特征。通过提供离子键来吸引水分，同时保持稳定的膏体分散性和流变性，解决了水基膏体水分快速蒸发的问题。报道了该浆料在特定温度和湿度条件下的筛网寿命。用该组合物制成的测试电路的电阻率为2.5-3.0 mW/平方/ 15毫米。扫描电镜显微图也显示了致密的微观结构，类似于由有机基糊状物制成的铜膜。

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Water-based Copper Oxide Compositions For Microcircuit Applications

For purposes of environmental protection, it is desirable to use water as a solvent to replace organics in electronic materials, Copper oxide compositions and hybrid circuit fabrication processes were developed. These pastes exhibited substantial organic content reduction, while preserving the characteristics of a typical organic-based copper paste. The rapid water evaporation problem of water-based pastes was resolved by providing ionic bonding to attract water while maintaining a stable paste dispersion and rheology. The screen life of this paste under specific temperaturehumidity conditions is reported. Test circuit made from the composition exhibited a resistivity of 2.5-3.0 mW/square/l5 mm. SEM micrographs also showed a dense microstructure similar to that of a copper film made from an organic-based paste.

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Proceedings of Japan International Electronic Manufacturing Technology Symposium

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