工业贴标机的状态维护

A. Acernese, C. D. Vecchio, M. Tipaldi, L. Glielmo
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引用次数: 0

摘要

本文报道了标签生产线切膜组数据驱动状态维护(CBM)的工业研究结果。本研究的目的是预测错误的标签切割。薄标签切割(厚度在30μm到38 μm之间)涉及的变量多,且高通量使得不合格标签的预测成为一个困难的目标。为此,我们为胶片切割组制定了完整的CBM策略。为了识别故障特征,对文献中提出的指标进行了详尽的评估,但没有一个指标适合满足问题约束。因此,我们根据我们的设置定制了最有希望的一个(即振动措施的均方根值),获得了显著的结果。鉴于CBM在薄膜切割中的贡献不足,我们相信这篇论文可能会引起学术研究人员或处理类似问题的工业人员的兴趣。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Condition Based Maintenance for Industrial Labeling Machine
This paper reports the outcome of an industrial research on data-driven Condition Based Maintenance (CBM) for the film cutting group of labeling production lines. Objective of the study has been the prediction of erroneous labels cut. The large number of variables involved in thin labels cut (thickness comprised within 30μm and 38 μm) and the high throughput make the prediction of non conforming labels a difficult goal. To this aim, we developed a complete CBM strategy for film cutting groups. To identify failure signature, an exhaustive assessment on indices suggested in literature was done, but none of them were suitable to satisfy problem constraints. Thus we customized the most promising one (namely the root mean square value of the vibration measures) to our setting obtaining notable results. Given the lack of contributions in CBM in thin film cutting, we believe this paper might be of interest for academic researchers or people from industry dealing with similar problems.
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