提高抗短路时间的0.6 ~ 1.7 kV功率碳化硅mosfet漂移层设计

Prashant Singh, Akshay K, Hema Lata Rao Maddi, A. Agrawal, S. Karmalkar
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引用次数: 0

摘要

我们提出了一种提高0.6 - 1.7 kV SiC功率mosfet的短路耐受时间(SCWT)的简单技术,其中漂移层电阻是导通电阻的一小部分。通过模拟,我们表明,通过增加漂移层的厚度和降低掺杂,这些器件的SCWT可以提高20%,而导通电阻仅增加5%。这种方法也使击穿电压提高了> 10%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of the Drift Layer of 0.6 – 1.7 kV Power Silicon Carbide MOSFETs for Enhanced Short Circuit Withstand Time
We propose a simple technique of raising the short circuit withstand time (SCWT) of 0.6 - 1.7 kV SiC power MOSFETs, where the drift layer resistance is a small fraction of the on-resistance. Using simulations, we show that the SCWT of these devices can be raised by upto 20% by increasing the thickness and lowering the doping of the drift layer at the cost of only 5 % increase in the on-resistance. This approach also raises the breakdown voltage by > 10%.
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