28nm FDSOI内嵌MOSFET,具有更好的击穿特性

N. K. Kranthi, R. Sithanandam, R. Komaragiri
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引用次数: 0

摘要

在这项工作中,提出了一种新的凹槽结构,改善了漏极通道结处的电场分布,从而改善了击穿电压。技术计算机辅助设计仿真结果表明,28nm完全耗尽绝缘体上硅MOSFET的断态击穿电压从1.8V扩展到3.3 V以上。对同一器件的击穿和直流特性进行了详细的研究。为了进一步提高击穿电压和直流特性,还研究了一种非对称的版本。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Recessed MOSFET in 28 nm FDSOI for Better Breakdown Characteristics
In this work, a novel recessed structure is proposed which improves the electric field distributions at the drain channel junction, hence the breakdown voltage. Technology computer aided design simulation results showed that the off state breakdown voltage of a 28 nm Fully Depleted Silicon on Insulator MOSFET is extended from 1.8V to 3.3 V or more. A detailed study is presented on the breakdown and DC characteristics of the same device. An asymmetric version of the same is also studied to further enhance the breakdown voltage and DC characteristics with and without Ground Plane (GP).
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