DELPHI-a status report on the European-funded project for the development of libraries and physical models for an integrated design environment

The accurate prediction of the operating temperatures of critical electronic parts at the component-, board- and system-level is seriously hampered by the lack of reliable, standardised input data. This paper reports an the status of work-in-progress in the 3-year European collaborative project, named DELPHI, whose goal is to solve the aforementioned problem. The project concerns the creation and experimental validation of thermal models (detailed and compact) of a range of electronic parts including mono-chip packages, heat sinks, electrolytic capacitors, transformers and interfacing materials. The purpose of this paper is to give an account of the principal project results. A bibliography of published DELPHI technical papers is provided.