K. Erbacher, Joao Alves Marques, Malte von Krshiwoblozki, Lixiang Wu, H. Ngo, M. Schneider-Ramelow
{"title":"航空声学MEMS麦克风在超薄柔性基板上的集成","authors":"K. Erbacher, Joao Alves Marques, Malte von Krshiwoblozki, Lixiang Wu, H. Ngo, M. Schneider-Ramelow","doi":"10.1109/EPTC56328.2022.10013281","DOIUrl":null,"url":null,"abstract":"The paper describes the integration of novel developed acoustic MEMS sensors, in an ultra-thin and flexible substrate for use in aerospace applications, such as wind tunnel test (WTT) and flight test (FT). The technology allows the fabrication of a large area array with flush mounted microphone sensors without any topography interfering with the flow. The final array contains more than 80 piezoresistive and piezoelectric MEMS sensors, at a dimension of 300×400 mm2. The thickness of the bare die array is 600 µm, the array with the packaged sensors below 1550 µm.","PeriodicalId":163034,"journal":{"name":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Aero Acoustic MEMS Microphone Integration in Ultra-Thin and Flexible Substrate\",\"authors\":\"K. Erbacher, Joao Alves Marques, Malte von Krshiwoblozki, Lixiang Wu, H. Ngo, M. Schneider-Ramelow\",\"doi\":\"10.1109/EPTC56328.2022.10013281\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper describes the integration of novel developed acoustic MEMS sensors, in an ultra-thin and flexible substrate for use in aerospace applications, such as wind tunnel test (WTT) and flight test (FT). The technology allows the fabrication of a large area array with flush mounted microphone sensors without any topography interfering with the flow. The final array contains more than 80 piezoresistive and piezoelectric MEMS sensors, at a dimension of 300×400 mm2. The thickness of the bare die array is 600 µm, the array with the packaged sensors below 1550 µm.\",\"PeriodicalId\":163034,\"journal\":{\"name\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-12-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC56328.2022.10013281\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC56328.2022.10013281","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Aero Acoustic MEMS Microphone Integration in Ultra-Thin and Flexible Substrate
The paper describes the integration of novel developed acoustic MEMS sensors, in an ultra-thin and flexible substrate for use in aerospace applications, such as wind tunnel test (WTT) and flight test (FT). The technology allows the fabrication of a large area array with flush mounted microphone sensors without any topography interfering with the flow. The final array contains more than 80 piezoresistive and piezoelectric MEMS sensors, at a dimension of 300×400 mm2. The thickness of the bare die array is 600 µm, the array with the packaged sensors below 1550 µm.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
