恒定传播的LEC漏洞

S. Srivastav, Ming Yi Lim, Babu Trp, K. Y. Jeevan
{"title":"恒定传播的LEC漏洞","authors":"S. Srivastav, Ming Yi Lim, Babu Trp, K. Y. Jeevan","doi":"10.1109/ISQED51717.2021.9424340","DOIUrl":null,"url":null,"abstract":"LEC is the most widely used tool for formal equivalence verification and ECO generation, but there are gaps in modeling of constant in LEC which can lead to silicon bugs even though the verification has passed. This issue is observed in designs which have gone through ECO’s. This paper covers scenarios where there are potential bugs masked by LEC/ECO due to this limitation and proposes a methodology to mitigate it.","PeriodicalId":302936,"journal":{"name":"IEEE International Symposium on Quality Electronic Design","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"LEC Vulnerability on Constant Propagation\",\"authors\":\"S. Srivastav, Ming Yi Lim, Babu Trp, K. Y. Jeevan\",\"doi\":\"10.1109/ISQED51717.2021.9424340\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"LEC is the most widely used tool for formal equivalence verification and ECO generation, but there are gaps in modeling of constant in LEC which can lead to silicon bugs even though the verification has passed. This issue is observed in designs which have gone through ECO’s. This paper covers scenarios where there are potential bugs masked by LEC/ECO due to this limitation and proposes a methodology to mitigate it.\",\"PeriodicalId\":302936,\"journal\":{\"name\":\"IEEE International Symposium on Quality Electronic Design\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-04-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE International Symposium on Quality Electronic Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED51717.2021.9424340\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE International Symposium on Quality Electronic Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED51717.2021.9424340","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

LEC是形式等效验证和ECO生成中使用最广泛的工具,但LEC中存在常数建模的空白,即使验证通过,也可能导致硅错误。这个问题在通过ECO的设计中可以观察到。本文涵盖了由于这种限制而被LEC/ECO掩盖的潜在bug的场景,并提出了一种方法来缓解它。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
LEC Vulnerability on Constant Propagation
LEC is the most widely used tool for formal equivalence verification and ECO generation, but there are gaps in modeling of constant in LEC which can lead to silicon bugs even though the verification has passed. This issue is observed in designs which have gone through ECO’s. This paper covers scenarios where there are potential bugs masked by LEC/ECO due to this limitation and proposes a methodology to mitigate it.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信