选择3D技术时的良率考虑

2007 International Symposium on Semiconductor Manufacturing Pub Date : 2007-10-01 DOI:10.1109/ISSM.2007.4446880

G. Smith, L. Smith, S. Hosali, S. Arkalgud

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引用次数: 49

摘要

如果测试可以识别好的芯片并减少好的和坏的芯片对的堆叠，那么晶圆到晶圆(DtW)堆叠提供了优于晶圆到晶圆(WtW)和片上系统(SoC)的良率优势。在本研究中，将SoC分成两个相等的区域形成三维系统，并比较了DtW和WtW的最佳产率。测试不需要完美，就可以实现DtW的显著良率优势。

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Yield considerations in the choice of 3D technology

Die-to-wafer (DtW) stacking offers a yield advantage over wafer-to-wafer (WtW) and system-on-a-chip (SoC) if testing can identify good die and reduce stacking of good and bad die pairs. In this study, an SoC is broken into two equal areas to form a 3D system, and best case yields of DtW and WtW is compared. Testing need not be perfect to realize significant yield advantage with DtW.

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来源期刊

2007 International Symposium on Semiconductor Manufacturing

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