用于单端口SRAM的准平面三栅极(QPT)体CMOS技术

Y. Tsukamoto, M. Yabuuchi, H. Fujiwara, K. Nii, C. Shin, T. Liu
{"title":"用于单端口SRAM的准平面三栅极(QPT)体CMOS技术","authors":"Y. Tsukamoto, M. Yabuuchi, H. Fujiwara, K. Nii, C. Shin, T. Liu","doi":"10.1109/ISQED.2012.6187505","DOIUrl":null,"url":null,"abstract":"Quasi-Planar Tri-gate (QPT) Bulk MOSFETs are fabricated simply by slightly recessing the shallow trench isolation (STI) oxide prior to gate-stack formation. In this cost-effective manner, 7% higher performance with lower leakage current in QPT bulk devices (vs. planar bulk devices) is achieved. QPT-based single-port SRAM characteristics can be improved by employing circuit design techniques (i.e., read- and write-assist circuitry) to compensate for unequal improvements in n-channel vs. p-channel QPT devices, to improve cell yield.","PeriodicalId":205874,"journal":{"name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Quasi-Planar Tri-gate (QPT) bulk CMOS technology for single-port SRAM application\",\"authors\":\"Y. Tsukamoto, M. Yabuuchi, H. Fujiwara, K. Nii, C. Shin, T. Liu\",\"doi\":\"10.1109/ISQED.2012.6187505\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Quasi-Planar Tri-gate (QPT) Bulk MOSFETs are fabricated simply by slightly recessing the shallow trench isolation (STI) oxide prior to gate-stack formation. In this cost-effective manner, 7% higher performance with lower leakage current in QPT bulk devices (vs. planar bulk devices) is achieved. QPT-based single-port SRAM characteristics can be improved by employing circuit design techniques (i.e., read- and write-assist circuitry) to compensate for unequal improvements in n-channel vs. p-channel QPT devices, to improve cell yield.\",\"PeriodicalId\":205874,\"journal\":{\"name\":\"Thirteenth International Symposium on Quality Electronic Design (ISQED)\",\"volume\":\"88 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-03-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Thirteenth International Symposium on Quality Electronic Design (ISQED)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED.2012.6187505\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2012.6187505","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

准平面三栅极(QPT)体mosfet是通过在栅极堆形成之前稍微嵌入浅沟槽隔离(STI)氧化物来制造的。在这种具有成本效益的方式下,QPT体块器件(与平面体块器件相比)的泄漏电流较低,性能提高7%。基于QPT的单端口SRAM特性可以通过采用电路设计技术(即读写辅助电路)来改善,以补偿n通道与p通道QPT器件的不平等改进,从而提高细胞产量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Quasi-Planar Tri-gate (QPT) bulk CMOS technology for single-port SRAM application
Quasi-Planar Tri-gate (QPT) Bulk MOSFETs are fabricated simply by slightly recessing the shallow trench isolation (STI) oxide prior to gate-stack formation. In this cost-effective manner, 7% higher performance with lower leakage current in QPT bulk devices (vs. planar bulk devices) is achieved. QPT-based single-port SRAM characteristics can be improved by employing circuit design techniques (i.e., read- and write-assist circuitry) to compensate for unequal improvements in n-channel vs. p-channel QPT devices, to improve cell yield.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信