不同源极/漏极配置下AlGaN/GaN MOSHEMTs的导电机理分析

B. Canales, G. J. Carmo, P. Agopian
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引用次数: 6

摘要

本文分析了一种Al2O3/AlGaN/AlN/GaN金属氧化物半导体高电子迁移率晶体管(MOSHEMT),并在考虑不同栅源和栅漏距离以及不同源极和漏极接触深度的情况下,对其导电机理进行了研究。器件最多可以有3个传导通道,其中2个通道与2DEG的形成有关,1个通道依赖于MOS结构的场效应。HEMT的导通更受源极和漏极触点深度的影响,而MOS的导通似乎更受栅极到源极和栅极到漏极距离的影响。每一种导体都以不同的方式影响总漏极电流。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The conduction mechanisms analysis of AlGaN/GaN MOSHEMTs with different source/drain electrode configurations
In this work, an Al2O3/AlGaN/AlN/GaN metal oxide semiconductor high electron mobility transistor (MOSHEMT) is analyzed and the investigation of its conduction mechanisms is carried out considering different gate to source and gate to drain distances, as well as different source and drain contact depths. The devices can have up to 3 conduction channels, of which two of them are related to the 2DEG formation and one of them depends on field effect on MOS structure. While the HEMT conduction is more influenced by the source and drain contacts depth, the MOS conduction seems to be more affected by the gate to source and gate to drain distances. Each of these conductions influence the total drain current in a different way.
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