高压元件双极异质晶体管优化制造及提高其集成率的研究。会计错配导致压力

E. Pankratov
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引用次数: 0

摘要

目前,固态电子学的几个实际问题(如提高集成电路元件的性能、可靠性和密度:二极管、场效应和双极晶体管)正在集中解决[1-6]。为了提高这些器件的性能,人们对确定具有更高载流子迁移率值的材料很感兴趣[7-10]。减小集成电路元件尺寸的一种方法是在薄膜异质结构中制造它们[3-5,11]。在这种情况下,可以利用异质结构的不均匀性和必要的电子材料掺杂优化[12,13]和外延技术的发展来改进这些材料(包括失配诱导应力的分析)[14-16]。增加集成电路尺寸的另一种方法是使用激光和微波退火[17-19]。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On Optimized Manufacture of Bipolar Hetero transistors in a High-Voltage Element or for Increasing of their Integration Rate. Accounting Mismatch-Induced Stress
In the present time several actual problems of the solid state electronics (such as increasing of performance, reliability and density of elements of integrated circuits: diodes, field-effect and bipolar transistors) are intensively solving [1-6]. To increase the performance of these devices it is attracted an interest determination of materials with higher values of charge carriers mobility [7-10]. One way to decrease dimensions of elements of integrated circuits is manufacturing them in thin film heterostructures [3-5,11]. In this case it is possible to use inhomogeneity of heterostructure and necessary optimization of doping of electronic materials [12,13] and development of epitaxial technology to improve these materials (including analysis of mismatch induced stress) [14-16]. An alternative approaches to increase dimensions of integrated circuits are using of laser and microwave types of annealing [17-19].
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