{"title":"非线性热传导问题紧凑建模的新方法","authors":"L. Codecasa","doi":"10.1109/THERMINIC.2013.6675220","DOIUrl":null,"url":null,"abstract":"In this paper a novel approach is proposed for generating dynamic compact models of nonlinear heat diffusion problems for electronics components. The method is very efficient and leads to accurate approximations of the space-time distribution of temperature rise within the component for all waveforms of the injected powers.","PeriodicalId":369128,"journal":{"name":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"Novel approach to compact modeling for nonlinear thermal conduction problems\",\"authors\":\"L. Codecasa\",\"doi\":\"10.1109/THERMINIC.2013.6675220\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper a novel approach is proposed for generating dynamic compact models of nonlinear heat diffusion problems for electronics components. The method is very efficient and leads to accurate approximations of the space-time distribution of temperature rise within the component for all waveforms of the injected powers.\",\"PeriodicalId\":369128,\"journal\":{\"name\":\"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-12-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/THERMINIC.2013.6675220\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/THERMINIC.2013.6675220","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Novel approach to compact modeling for nonlinear thermal conduction problems
In this paper a novel approach is proposed for generating dynamic compact models of nonlinear heat diffusion problems for electronics components. The method is very efficient and leads to accurate approximations of the space-time distribution of temperature rise within the component for all waveforms of the injected powers.