高压集成电路中基于soi的器件和技术

F. Udrea
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引用次数: 47

摘要

本文综述了用于高压集成电路的绝缘体上硅(SOI)器件和技术的现状,并讨论了该领域的新趋势。本文重点介绍了基于SOI的新型RESURF概念,如超结、线性梯度剖面或SOI膜技术。由于其固有的隔离特性,SOI是双极MOS开关(如light)的理想衬底。事实上,市场上唯一的light产品是使用介电隔离(SOI类型)和SOI技术制造的。本文最后从具体的Ron vs击穿电压的角度概述了技术生存的激烈斗争。在这方面,SOI与准垂直DMOS技术和先进的批量BCD技术竞争。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SOI-based devices and technologies for High Voltage ICs
This paper reviews the current status Silicon-On-Insulator (SOI) devices and technologies for high voltage integrated circuits (HVICs) and discusses new trends in the field. The paper focuses on novel SOI-based RESURF concepts such as superjunction, linearly graded profile or SOI membrane technology. Due to its intrinsic isolation properties, the SOI is the ideal substrate for bipolar MOS switches such as the LIGBT. In fact, the only LIGBT products on the market are fabricated using Dielectric Isolation (type of SOI) and SOI technology. The paper finishes with an overview of the fierce fight of technology survival in terms of specific Ron vs breakdown voltage. Here the SOI competes with quasi-vertical DMOS technologies and advanced bulk BCD technologies.
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