Thermal via placement for high-power applications

Thermal management in electronics continues to be one of the most important fields which can take part in ensuring the reliability of an electronic system. Heat transfer, from a system to the ambient, must be optimized, and even a temperature with 1°C less can have an effect in prolonging the life of an electronic component. The research presented in this paper aims to decrease the junction temperature of a power device, by optimizing the placement of thermal vias underneath the IC. Various thermal vias placement scenarios are analyzed and their benefit in improving the thermal dissipation from a component to the PCB and ambient is discussed.