使用交错单元技术的32 × 9 ECL双地址寄存器

J. Reinert, M. Glazer
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引用次数: 2

摘要

一个32字× 9位的双地址寄存器堆栈(DAS),它使用交错ECL单元技术来实现与先前报道的单端口ECL存储器的速度相当的地址访问速度。ECL LSI器件具有两个独立的存储端口,每个端口都具有完整的数据、读写能力、奇偶校验功能和输出存储寄存器。另外,如图功能框图1所示,电路信号出错时,将其定义为系统出错;例如,同时向同一地址写入数据。并行字,双端口,组织,需要18个输入/输出端口与单独的数据路径和大量的支持错误检测电路,需要一个紧凑的存储单元,以实现合理的芯片尺寸。同时,必须保持ECL内存访问速度,以适应作为“I0800位切片处理器系列中的寄存器文件的主应用程序。ECL存储单元方法看起来很有吸引力,因为它可以实现高密度和快速的读/写性能。然而,由于RAM的电压移位寻址方式和较小的ECL单元电压差,交叉端口地址和位线变化对数据完整性的影响令人担忧。采用的双单元方法通过本质上交错两个独立的存储器来避免这些问题,具有寻址激活的写过能力。交错技术提供了高端口到端口干扰隔离的优点,一个经过验证的基本元件存储单元,通过利用集成器件技术和最小化隔离区域,小单元尺寸。图2说明了ECL存储单元的合并性质,负载电阻,肖特基二极管和两个晶体管在一个隔离区域。在双单元中,所有发射从动器被放置在一个共同的N区域,以进一步减小阵列面积。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 32 x 9 ECL dual address register using an interleaving cell technique
A 32-WORD BY 9-BIT Dual Address Register Stack (DAS) which uses an interleaving ECL cell technique to achieve address access speeds comparable to previously-reported speeds for single port ECL memories' will be described. The ECL LSI device has two independent memory ports, each having full data, read/write capability, parity function and-output storage register. In addition, as shown in the functional block diagram, Figure 1, an error circuit signals when operations defined as system errors; e.g., simultaneous write to the same address, are performed. The parallel word, dual port, organization, requiring 18 input/output ports with individual data paths and a large amount of support error detection circuitry necessitated a compact storage cell to achieve a reasonable die size. At the same time ECL memory access speeds had to be maintained to fit the primary application as a register file in the "I0800 bit slize processor family. An ECL memory cell approach looked attractive in that high density and fast read/write performance could be achieved. However, because of the RAM voltage shift addressing mode and the small ECL cell voltage differential, the effect of cross port address and bit line changes on data integrity was feared. The dual cell approach adopted avoids these problems by essentially interleaving two independent memories, with an addressing activated write over capability. The interleaving technique provides the advantages of high port-to-port disturb isolation, a proven memory cell for the basic element and small cell size by utilization of integrated device techniques and minimization of isolation areas. Figure 2 illustrates the merged nature of an ECL memory cell, with load resistor, Schottky diode and two transistors in one isolation region. In the dual cell all emitter followers are placed in a common N region to further reduce array area.
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