Plastic VCSEL array packaging and high density polymer waveguides for board and backplane optical interconnect

The technical approach and progress achieved under the Polymer Optical Interconnect Technology (POINT) program are described in this paper. The POINT program is a collaborative effort among GE, Honeywell, AMP, AlliedSignal, Columbia University, and University of California at San Diego (UCSD), sponsored by DARPA/ETO, to develop affordable optoelectronic packaging and interconnect technologies for board and backplane applications. Specifically, progress is reported on (a) development of batch-operated plastic VCSEL array packaging technology using planar fabrication, (b) demonstration of high-density optical interconnects for board and backplane applications using polymer waveguides to a length of 50 cm at an I/O density of 250 channels per inch, (c) development of low-loss optical polymer waveguides with loss less than 0.1 dB/cm at 850 nm, and (d) development of passive alignment processes for efficient coupling between a VCSEL array and polymer waveguides. Significant progress has also been made under the POINT program at Columbia University, in applying CAD tools to simulate multimode-guided wave systems and, at UCSD, to assist mechanical and thermal design in optoelectronic packaging.