在纸上集成印刷混合电子器件

Henrik Sandberg, Cristina Gaspar, L. Hakola, Corné Rentrop
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引用次数: 6

摘要

印刷电子产品被视为目前大规模生产的电子模块的超低成本替代品,用于实现简单的功能或效果。在现实中,只有非常基本的电子功能可以实现纯增材印刷和涂层技术。即使对于最简单的功能电子电路,也需要采用混合制造方法,使用标准SMD组件中的元件以及传统的转换技术。为了实现低成本目标,必须对每个加工步骤进行评估,以便在功能和加工以及材料成本之间取得平衡。卷对卷生产通常被认为是制造大量设备的最具成本效益的方法,而大批量生产是低成本的先决条件。我们在ROPAS项目(EC FP7资助协议no . 263078)中展示了用于生产基于纸作为基材的电子防篡改指示器的制造工艺,该工艺具有超低的批量成本。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Integrated printed hybrid electronics on paper
Printed electronics is seen as an ultralow cost alternative to current mass produced electronic modules for achieving a simple function or effect. In reality only very basic electronic functions can be realized using purely additive printing and coating techniques. Even for the most simple functional electronic circuit hybrid manufacturing methods need to be employed using elements from standard SMD components as well as traditional converting technologies. In order to achieve the low cost target each processing step must be evaluated in order to reach a balance between functionality and processing as well as material cost. Reel to reel production is commonly regarded as the most cost efficient method to manufacture very high volumes of devices, and high volume is a prerequisite for low cost. We demonstrate in the ROPAS project (EC FP7 grant agreement no 263078) the manufacturing process employed to produce an electronic anti-tampering indicator based on paper as a substrate for ultra-low cost in large volumes.
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