双掺杂半heusler合金的热电性能

C. Uher, J. Yang, G. Meisner
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引用次数: 4

摘要

基于我们对sb掺杂zrnisn型半heusler金属间化合物的初步研究结果,我们制备了一系列新的Bi掺杂样品Zr/sub 0.5/Hf/sub 0.5/NiSn/sub 1-x/Bi/sub x/,其浓度范围为0/spl les/x/spl les/0.02。虽然Zr和Hf的等电子合金化降低了晶格导热系数,但在Sn位点掺杂Hf控制了载流子密度,从而控制了输运性质。这证实了我们之前报道的Sb的趋势,即少量的V族半金属取代在sn位点上对所有输运性质都有显著的影响。具体来说,由于载流子密度高了一个数量级,电阻率大大降低,并且热功率非常大(x=0.01时/spl sim/-250 /spl mu/V/K),与母体(未掺杂)化合物的热功率相当。因此,在Sn位点掺杂Sb或Hi是在这些半heusler金属间化合物中获得高功率因数的有效方法。金属间化合物的最佳工作范围在室温以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermoelectric properties of Bi-doped half-Heusler alloys
Based on our preliminary promising results for Sb-doped ZrNiSn-type half-Heusler intermetallics, we made a new series of Bi-doped samples Zr/sub 0.5/Hf/sub 0.5/NiSn/sub 1-x/Bi/sub x/ with concentrations x in the range 0/spl les/x/spl les/0.02. While the isoelectronic alloying of Zr and Hf reduces the lattice thermal conductivity, doping on the Sn site with Hf controls the carrier density and thus the nature of transport. This confirms the trend we reported previously for Sb, namely, that a small amount of the group V semimetal substituted on the Sn-site has a spectacular effect on all transport properties. Specifically, the electrical resistivity is much reduced due to an order of magnitude higher carrier density, and the thermopower is exceptionally large (/spl sim/-250 /spl mu/V/K for x=0.01), comparable to the thermopower of the parent (undoped) compound. Doping on the Sn site with Sb or Hi is thus an effective way to achieve high power factors in these half-Heusler intermetallics. The optimal operational range of the intermetallics is above room temperature.
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