{"title":"基于通用表面增强拉曼光谱的晶圆上有机缺陷综述与分类","authors":"A. Altun","doi":"10.1109/asmc54647.2022.9792487","DOIUrl":null,"url":null,"abstract":"The paper will introduce a novel 300mm wafer defect review and characterization technology based on universal on-wafer surface-enhanced Raman spectroscopy. The technology can perform high-throughput physical and chemical classification of defects using surface-enhanced optical images and enhanced Raman spectroscopy, respectively. The paper will demonstrate test data regarding size distributions, optical images and Raman spectra of particles of process liquids as well as test wafers.","PeriodicalId":436890,"journal":{"name":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"On-wafer organic defect review and classification with universal surface enhanced Raman spectroscopy\",\"authors\":\"A. Altun\",\"doi\":\"10.1109/asmc54647.2022.9792487\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper will introduce a novel 300mm wafer defect review and characterization technology based on universal on-wafer surface-enhanced Raman spectroscopy. The technology can perform high-throughput physical and chemical classification of defects using surface-enhanced optical images and enhanced Raman spectroscopy, respectively. The paper will demonstrate test data regarding size distributions, optical images and Raman spectra of particles of process liquids as well as test wafers.\",\"PeriodicalId\":436890,\"journal\":{\"name\":\"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/asmc54647.2022.9792487\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/asmc54647.2022.9792487","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
On-wafer organic defect review and classification with universal surface enhanced Raman spectroscopy
The paper will introduce a novel 300mm wafer defect review and characterization technology based on universal on-wafer surface-enhanced Raman spectroscopy. The technology can perform high-throughput physical and chemical classification of defects using surface-enhanced optical images and enhanced Raman spectroscopy, respectively. The paper will demonstrate test data regarding size distributions, optical images and Raman spectra of particles of process liquids as well as test wafers.
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