{"title":"德州仪器的PWB热建模计算机工具","authors":"S. West, J. K. Pylant","doi":"10.1109/SEMTHE.1988.10609","DOIUrl":null,"url":null,"abstract":"Printed wiring board (PWB) thermal modeling tools developed at Texas Instruments are described. These general programs help automate the processes of: finite-difference-model generation for PWBs and other rectangular, layered structures; definition of heat inputs to a thermal model of a PWB due to electronic components; and calculation of component junction temperatures for devices located on a modeled PWB. The features of the programs are described and their usefulness in the design environment is explained. The direction of current and anticipated future development is addressed.<<ETX>>","PeriodicalId":162566,"journal":{"name":"Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-02-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"PWB thermal modeling computer tools at Texas Instruments\",\"authors\":\"S. West, J. K. Pylant\",\"doi\":\"10.1109/SEMTHE.1988.10609\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Printed wiring board (PWB) thermal modeling tools developed at Texas Instruments are described. These general programs help automate the processes of: finite-difference-model generation for PWBs and other rectangular, layered structures; definition of heat inputs to a thermal model of a PWB due to electronic components; and calculation of component junction temperatures for devices located on a modeled PWB. The features of the programs are described and their usefulness in the design environment is explained. The direction of current and anticipated future development is addressed.<<ETX>>\",\"PeriodicalId\":162566,\"journal\":{\"name\":\"Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium\",\"volume\":\"10 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1988-02-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SEMTHE.1988.10609\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SEMTHE.1988.10609","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
PWB thermal modeling computer tools at Texas Instruments
Printed wiring board (PWB) thermal modeling tools developed at Texas Instruments are described. These general programs help automate the processes of: finite-difference-model generation for PWBs and other rectangular, layered structures; definition of heat inputs to a thermal model of a PWB due to electronic components; and calculation of component junction temperatures for devices located on a modeled PWB. The features of the programs are described and their usefulness in the design environment is explained. The direction of current and anticipated future development is addressed.<>
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