单晶圆加工的趋势

R. Doering
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引用次数: 10

摘要

在过去的三十年中,半导体制造业最显著的趋势之一是批量加工逐渐被单晶圆加工所取代。另外两个趋势,使用更大的硅片(以降低制造成本)和对更苛刻的工艺性能规格的需求(以允许持续的器件电路缩放),推动了这种向许多工艺的单晶圆设备的转变。现在生产100%单晶圆加工的硅集成电路在技术上是可行的。在未来十年,这样做在经济上也可能变得可行
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Trends in single-wafer processing
It is pointed out that one of the most significant trends in semiconductor manufacturing over the past three decades has been the gradual replacement of batch processing with single-wafer processing. Two other trends, the use of larger silicon wafers (to reduce manufacturing cost) and the necessity for more demanding process-performance specifications (to allow continued device circuit scaling), have driven this move to single-wafer equipment for many processes. It is now technically feasible to produce silicon integrated circuits with 100% single-wafer processing. In the next decade, it may also become economically feasible to do so.<>
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