K. Seo, Y. Oka, Kotaro Nomura, M. Tsutsue, E. Kobori, K. Goto, Y. Mizukami, T. Ohtsuka, K. Tsukamoto, S. Matsumoto, T. Ueda
{"title":"多孔SiOC的多步紫外固化新工艺","authors":"K. Seo, Y. Oka, Kotaro Nomura, M. Tsutsue, E. Kobori, K. Goto, Y. Mizukami, T. Ohtsuka, K. Tsukamoto, S. Matsumoto, T. Ueda","doi":"10.1109/IITC.2009.5090352","DOIUrl":null,"url":null,"abstract":"In order to control the characteristics of porogen-based porous SiOC film (k ≪ 2.5), we investigated its dependence on the wavelengths of ultraviolet (UV) light by using methods of FT-IR, TDS and nano-indentation. As a result, it was found that specific wavelengths of UV light strongly was effective to porous SiOC film production : porogen desorption, mechanical strength improvement, and reduction of the film damage. Vacuum ultraviolet (VUV) irradiation is necessary for porogen desorption. However, after porogen was removed from SiOC film, the energy of VUV irradiation was too high for porous SiOC film and this caused film damage. The energy of deep ultraviolet (DUV) irradiation was sufficient to improve mechanical strength. We propose that UV curing process should be a multi-step process consisting of VUV and DUV irradiation (Figure 1). The first step removes porogen using VUV irradiation. The second step forms robust porous SiOC film using DUV irradiation. A multi-step curing process was used to control the characteristics of porogen-based porous SiOC film.","PeriodicalId":301012,"journal":{"name":"2009 IEEE International Interconnect Technology Conference","volume":"94 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"New multi-step UV curing process for porogen-based porous SiOC\",\"authors\":\"K. Seo, Y. Oka, Kotaro Nomura, M. Tsutsue, E. Kobori, K. Goto, Y. Mizukami, T. Ohtsuka, K. Tsukamoto, S. Matsumoto, T. Ueda\",\"doi\":\"10.1109/IITC.2009.5090352\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In order to control the characteristics of porogen-based porous SiOC film (k ≪ 2.5), we investigated its dependence on the wavelengths of ultraviolet (UV) light by using methods of FT-IR, TDS and nano-indentation. As a result, it was found that specific wavelengths of UV light strongly was effective to porous SiOC film production : porogen desorption, mechanical strength improvement, and reduction of the film damage. Vacuum ultraviolet (VUV) irradiation is necessary for porogen desorption. However, after porogen was removed from SiOC film, the energy of VUV irradiation was too high for porous SiOC film and this caused film damage. The energy of deep ultraviolet (DUV) irradiation was sufficient to improve mechanical strength. We propose that UV curing process should be a multi-step process consisting of VUV and DUV irradiation (Figure 1). The first step removes porogen using VUV irradiation. The second step forms robust porous SiOC film using DUV irradiation. A multi-step curing process was used to control the characteristics of porogen-based porous SiOC film.\",\"PeriodicalId\":301012,\"journal\":{\"name\":\"2009 IEEE International Interconnect Technology Conference\",\"volume\":\"94 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE International Interconnect Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2009.5090352\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE International Interconnect Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2009.5090352","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
New multi-step UV curing process for porogen-based porous SiOC
In order to control the characteristics of porogen-based porous SiOC film (k ≪ 2.5), we investigated its dependence on the wavelengths of ultraviolet (UV) light by using methods of FT-IR, TDS and nano-indentation. As a result, it was found that specific wavelengths of UV light strongly was effective to porous SiOC film production : porogen desorption, mechanical strength improvement, and reduction of the film damage. Vacuum ultraviolet (VUV) irradiation is necessary for porogen desorption. However, after porogen was removed from SiOC film, the energy of VUV irradiation was too high for porous SiOC film and this caused film damage. The energy of deep ultraviolet (DUV) irradiation was sufficient to improve mechanical strength. We propose that UV curing process should be a multi-step process consisting of VUV and DUV irradiation (Figure 1). The first step removes porogen using VUV irradiation. The second step forms robust porous SiOC film using DUV irradiation. A multi-step curing process was used to control the characteristics of porogen-based porous SiOC film.
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