芯片封装相互作用的研究——寻求产品认证测试的加速

2009 IEEE International Reliability Physics Symposium Pub Date : 2009-04-26 DOI:10.1109/IRPS.2009.5173379

W. Kanert, R. Pufall

{"title":"芯片封装相互作用的研究——寻求产品认证测试的加速","authors":"W. Kanert, R. Pufall","doi":"10.1109/IRPS.2009.5173379","DOIUrl":null,"url":null,"abstract":"Chip-package interaction is a major concern for product reliability. Temperature cycling is a commonly used stress test to address this issue. The paper shows that temperature shock can substitute temperature cycling for certain failure mechanisms, thereby reducing stress times by a factor of 28 or even more.","PeriodicalId":345860,"journal":{"name":"2009 IEEE International Reliability Physics Symposium","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Investigation of chip-package interaction-looking for more acceleration in product qualification tests\",\"authors\":\"W. Kanert, R. Pufall\",\"doi\":\"10.1109/IRPS.2009.5173379\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Chip-package interaction is a major concern for product reliability. Temperature cycling is a commonly used stress test to address this issue. The paper shows that temperature shock can substitute temperature cycling for certain failure mechanisms, thereby reducing stress times by a factor of 28 or even more.\",\"PeriodicalId\":345860,\"journal\":{\"name\":\"2009 IEEE International Reliability Physics Symposium\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-04-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.2009.5173379\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.2009.5173379","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 8

摘要

芯片与封装之间的相互作用是影响产品可靠性的主要因素。温度循环是解决这个问题的常用压力测试。本文表明，温度冲击可以代替温度循环代替某些破坏机制，从而将应力次数减少28倍甚至更多。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Investigation of chip-package interaction-looking for more acceleration in product qualification tests

Chip-package interaction is a major concern for product reliability. Temperature cycling is a commonly used stress test to address this issue. The paper shows that temperature shock can substitute temperature cycling for certain failure mechanisms, thereby reducing stress times by a factor of 28 or even more.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2009 IEEE International Reliability Physics Symposium

自引率

0.00%

发文量