硅清洁对90nm CMOS器件性能的影响

J. Carrere, H. Bernard, S. Petitdidier, A. Beverina, J. Rosa, F. Guyader
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引用次数: 2

摘要

我们在本文中表明,通过最大限度地减少双栅氧化模块的湿清洗过程所导致的硅消耗,可以提高90 nm NMOS的性能。完整的分析表明,电子迁移率的提高与硅清洁消耗的降低之间存在良好的相关性。我们还讨论了为什么这些清洗不会改变PMOS的行为。此外,测量到环形振荡器的延迟降低了4%。最后,厚栅和薄栅的氧化质量都得到了保留:这表明在硅清洁效率和器件性能改进之间找到了理想的折衷方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon clean impact on 90nm CMOS devices performance
We show in this paper that 90 nm NMOS performance can be enhanced by minimizing the silicon consumption due to the wet cleaning processes of the double gate oxide module. A complete analysis is presented, showing a good correlation between the increase of the electron mobility and the reduction of the silicon clean consumption. We also discuss why the PMOS behavior is not altered by these cleans. Moreover, a 4% delay reduction on ring oscillators is measured. Finally, both the thick and thin gate oxide quality has been preserved: this shows that an ideal compromise has been found between the silicon cleaning efficiency and the device performance improvement.
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