Chenning Ge, Shiwei Feng, Guangchen Zhang, Kaikai Ding, Peifeng Hu, H. Deng
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Enhanced thermal measurements of high power LEDs by junction characteristic
The measurements of junction temperature rise and thermal resistance of power LEDs by junction characteristic are proposed in this paper. The measured thermal resistance is corrected by the light-absorbing method. It is also proved that the physical meaning of the electrical average temperature rise of series LED array system is the arithmetic mean of the temperature rise of all sub-LEDs in the system. Therefore, a novel method to extract the temperature distribution of series LED systems is presented.
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