外围电机驱动PIC集成LDMOS技术的关注

B. Smith, J. Xu, J. Devore, A. Chellamuthu, B. Amey, S. Pendharkar, T. Efland
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引用次数: 9

摘要

这项工作回顾了常见的电机类型,驱动方法,以及功率LDMOS驱动器的相关要求,包括BVdss, Rdson和SOA,用于高达60 V的外围产品应用。讨论了各种工艺、功率效率和电路实现之间的权衡。本文探讨了其他电机驱动的具体问题,如基板注入、寄生npn/pnp效应和鲁棒性、反向恢复和ESD。集成问题和敏感电路隔离技术也包括在内。介绍了外围产品功率ic (PICs)的简短工艺技术大纲。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Peripheral motor drive PIC concerns for integrated LDMOS technologies
This work reviews common motor types, driving methods, and associated requirements of power LDMOS drivers including BVdss, Rdson, and SOA for peripheral product applications up to 60 V. Tradeoffs made between various processes, power efficiency, and circuit implementations are discussed. The paper explores additional motor driving specific concerns such as substrate injection, parasitic npn/pnp effects and robustness, reverse recovery, and ESD. Up integration concerns and sensitive circuit isolation techniques are also included. The introduction includes a short process technology outline for peripheral product power ICs (PICs).
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