改进的冲击电离建模和验证与pn结二极管

Zhihao Pan, S. Holland, D. Schroeder, W. Krautschneider
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引用次数: 6

摘要

为了提高TCAD工具的预测能力,必须对低电场和高电场下的冲击电离以及温度依赖性进行良好的建模。高场行为对具有低击穿电压的ESD保护器件特别感兴趣,这些器件用于保护采用现代技术制造的集成电路。本文用不同击穿电压的二极管检验了Valdinoci[1]提出的用Reggiani[2]参数估计冲击电离的模型。结果表明,该模型低估了二极管的实验击穿电压。其原因可以追溯到高电场下电子碰撞电离系数的高估。通过将模型参数调整为Van Overstraeten[3]和Grant[4]在7.7 × 105 V/cm的电场下测量硅中的冲击电离系数的实验,我们将模型的有效性扩展到高场。在新参数设置下,得到的击穿电压与实测击穿电压吻合得更好。为了验证冲击电离对温度的依赖性,在100 ns传输线脉冲(TLP)下进一步研究了二极管。与基于Chynoweth定律的成熟模型相反,新模型的模拟可以很好地再现测量到的大电流I-V特性。仿真结果可以很好地预测损伤的位置和破坏程度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Improved impact-ionization modelling and validation with pn-junction diodes
Impact-ionization at low and high electric field as well as the temperature dependence has to be modeled well in order to improve the predictive capability of TCAD tools. The high field behavior is of particular interest for ESD protection devices with low breakdown voltages which are used to protect ICs made with modern technologies. In this paper, the model for estimating the impact-ionization proposed by Valdinoci [1] with the parameters of Reggiani [2] has been examined with diodes of various breakdown voltages. It was found that the experimental breakdown voltages of the diodes are underestimated using that model. The cause was traced back to the overestimation of the electron impact-ionization coefficient at high electric fields. By adjusting the model parameters to the experiments of Van Overstraeten [3] and Grant [4], who measured the impact-ionization coefficient in silicon for fields up to 7.7 × 105 V/cm, we extend the model's validity to high fields. With the new parameter set, a much better agreement to the measured breakdown voltages is obtained. As a check for the temperature dependence of the impact-ionization, the diodes were further investigated under 100 ns transmission line pulses (TLP). The measured high-current I–V characteristic is well reproduced by simulations using the new model, as opposed to the well-established model based on Chynoweth's law. Both the failure level and the damage location are well predicted by the simulation.
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