回流炉局部焊料温度分布的计算

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI:10.1109/ESTC.2018.8546452

A. Yuile, S. Wiese

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引用次数: 3

摘要

本文介绍了计算流体力学(CFD)在电子制造技术领域的应用。重点研究了回流焊过程中焊点内温度的计算。本文显示了模拟在确定温度方面的优势，这是通过实验方法难以获得的。这些方法将有助于优化电子制造行业的回流焊工艺。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Calculation of local solder temperature profiles in reflow ovens

This paper presents the application of computational fluid dynamics (CFD) in the area of electronics manufacturing technology. It focuses on the calculation of temperatures within the solder joint during reflow soldering process. The paper shows the advantages of simulation in determining temperatures that are difficult to obtain through experimental methods. Such methods should help to optimise reflow soldering processes in the electronics manufacturing industry.

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2018 7th Electronic System-Integration Technology Conference (ESTC)

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