片上网络的磨损感知自适应路由

A. Vitkovski, V. Soteriou, Paul V. Gratz
{"title":"片上网络的磨损感知自适应路由","authors":"A. Vitkovski, V. Soteriou, Paul V. Gratz","doi":"10.1145/2786572.2786573","DOIUrl":null,"url":null,"abstract":"Chip-multiprocessors are facing worsening reliability due to prolonged operational stresses, with their tile-interconnecting Network-on-Chip (NoC) being especially vulnerable to wearout-induced failure. To tackle this ominous threat we present a novel wear-aware routing algorithm that continuously considers the stresses the NoC experiences at runtime, along with temperature and fabrication process variation metrics, steering traffic away from locations that are most prone to Electromigration (EM)- and Hot-Carrier Injection (HCI)-induced wear. Under realistic applications our wear-aware algorithm yields 66% and 8% average increases in mean-time-to-failure for EM and HCI, respectively.","PeriodicalId":228605,"journal":{"name":"Proceedings of the 9th International Symposium on Networks-on-Chip","volume":"67 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Wear-Aware Adaptive Routing for Networks-on-Chips\",\"authors\":\"A. Vitkovski, V. Soteriou, Paul V. Gratz\",\"doi\":\"10.1145/2786572.2786573\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Chip-multiprocessors are facing worsening reliability due to prolonged operational stresses, with their tile-interconnecting Network-on-Chip (NoC) being especially vulnerable to wearout-induced failure. To tackle this ominous threat we present a novel wear-aware routing algorithm that continuously considers the stresses the NoC experiences at runtime, along with temperature and fabrication process variation metrics, steering traffic away from locations that are most prone to Electromigration (EM)- and Hot-Carrier Injection (HCI)-induced wear. Under realistic applications our wear-aware algorithm yields 66% and 8% average increases in mean-time-to-failure for EM and HCI, respectively.\",\"PeriodicalId\":228605,\"journal\":{\"name\":\"Proceedings of the 9th International Symposium on Networks-on-Chip\",\"volume\":\"67 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-09-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 9th International Symposium on Networks-on-Chip\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/2786572.2786573\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 9th International Symposium on Networks-on-Chip","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/2786572.2786573","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

由于长时间的工作压力,芯片多处理器面临着可靠性下降的问题,它们的片上网络(NoC)尤其容易受到磨损引起的故障的影响。为了解决这一不利威胁,我们提出了一种新的磨损感知路由算法,该算法持续考虑NoC在运行时所经历的压力,以及温度和制造工艺变化指标,将交通从最容易发生电迁移(EM)和热载流子注入(HCI)引起的磨损的位置引导出来。在实际应用中,我们的磨损感知算法对EM和HCI的平均故障间隔时间分别提高了66%和8%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Wear-Aware Adaptive Routing for Networks-on-Chips
Chip-multiprocessors are facing worsening reliability due to prolonged operational stresses, with their tile-interconnecting Network-on-Chip (NoC) being especially vulnerable to wearout-induced failure. To tackle this ominous threat we present a novel wear-aware routing algorithm that continuously considers the stresses the NoC experiences at runtime, along with temperature and fabrication process variation metrics, steering traffic away from locations that are most prone to Electromigration (EM)- and Hot-Carrier Injection (HCI)-induced wear. Under realistic applications our wear-aware algorithm yields 66% and 8% average increases in mean-time-to-failure for EM and HCI, respectively.
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