分布式非对称厚膜信用证组件

V. Desnica, L. Zivanov, O. Aleksic, M. Lukovic, L. Lukic
{"title":"分布式非对称厚膜信用证组件","authors":"V. Desnica, L. Zivanov, O. Aleksic, M. Lukovic, L. Lukic","doi":"10.1109/ICMEL.2004.1314643","DOIUrl":null,"url":null,"abstract":"This paper presents planar thick film components and their practical implementations to filters. Different thick film L/C component geometries were designed, printed on alumina, fired and characterized in the HF range. They were asymmetric to input and output terminations, and to positive and negative (or ground) applied voltages and HF signals. L-inductive, C-capacitive parameters were distributed using different planar thick film constructions: inductor windings were printed as the top electrode of capacitor and vice versa, planar capacitors were printed between the windings. As a result, the groups of components were realized on 0.5 inch /spl times/ 1 inch; 1 inch /spl times/ 1 inch alumina substrates as DIL (dual-in-line package) matrix to serve as filter arrays in EMI (Electromagnetic Interference) suppression.","PeriodicalId":202761,"journal":{"name":"2004 24th International Conference on Microelectronics (IEEE Cat. No.04TH8716)","volume":"28 5","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Distributed asymmetrical thick film L/C components\",\"authors\":\"V. Desnica, L. Zivanov, O. Aleksic, M. Lukovic, L. Lukic\",\"doi\":\"10.1109/ICMEL.2004.1314643\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents planar thick film components and their practical implementations to filters. Different thick film L/C component geometries were designed, printed on alumina, fired and characterized in the HF range. They were asymmetric to input and output terminations, and to positive and negative (or ground) applied voltages and HF signals. L-inductive, C-capacitive parameters were distributed using different planar thick film constructions: inductor windings were printed as the top electrode of capacitor and vice versa, planar capacitors were printed between the windings. As a result, the groups of components were realized on 0.5 inch /spl times/ 1 inch; 1 inch /spl times/ 1 inch alumina substrates as DIL (dual-in-line package) matrix to serve as filter arrays in EMI (Electromagnetic Interference) suppression.\",\"PeriodicalId\":202761,\"journal\":{\"name\":\"2004 24th International Conference on Microelectronics (IEEE Cat. No.04TH8716)\",\"volume\":\"28 5\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-05-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2004 24th International Conference on Microelectronics (IEEE Cat. No.04TH8716)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMEL.2004.1314643\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 24th International Conference on Microelectronics (IEEE Cat. No.04TH8716)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMEL.2004.1314643","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文介绍了平面厚膜元件及其在滤波器中的实际应用。设计了不同的厚膜L/C元件几何形状,在氧化铝上印刷,烧制并在HF范围内进行了表征。它们对输入和输出端、正、负(或地)外加电压和高频信号是不对称的。l -电感和c -电容参数采用不同的平面厚膜结构进行分布:电感绕组作为电容器的上电极,反之,平面电容器在绕组之间印刷。因此,在0.5英寸/spl次/ 1英寸上实现了组件组;1英寸/spl倍/ 1英寸氧化铝基板作为DIL(双列直插式封装)矩阵,作为EMI(电磁干扰)抑制中的滤波器阵列。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Distributed asymmetrical thick film L/C components
This paper presents planar thick film components and their practical implementations to filters. Different thick film L/C component geometries were designed, printed on alumina, fired and characterized in the HF range. They were asymmetric to input and output terminations, and to positive and negative (or ground) applied voltages and HF signals. L-inductive, C-capacitive parameters were distributed using different planar thick film constructions: inductor windings were printed as the top electrode of capacitor and vice versa, planar capacitors were printed between the windings. As a result, the groups of components were realized on 0.5 inch /spl times/ 1 inch; 1 inch /spl times/ 1 inch alumina substrates as DIL (dual-in-line package) matrix to serve as filter arrays in EMI (Electromagnetic Interference) suppression.
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