{"title":"用于RDL中间体的先进低Dk和高密度光成像介电材料","authors":"Tetsuya Nemoto, Junichi Ooto, Hirokazu Ito, Koichi Hasegawa","doi":"10.23919/ICEP55381.2022.9795456","DOIUrl":null,"url":null,"abstract":"Future Redistribution Layer (RDL) interposer requires low dielectric constant (Dk) and high density RDL layers to improve signal and power integrity in high- performance computing (HPC) application. This paper proposes alkali-developable photo-imageable dielectrics (PID), FG-Series with low Dk of 2.9 at 10GHz, which enable 2μm-via patterning and provide biased high accelerated stress test (b- HAST) resistance on 2μm-L/S Cu traces. FG-series is promising candidates to enable low signal delay, high density and good reliability for RDL interposer.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"103 4","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Advanced Low Dk and High-Density Photo- Imageable Dielectrics for RDL Interposer\",\"authors\":\"Tetsuya Nemoto, Junichi Ooto, Hirokazu Ito, Koichi Hasegawa\",\"doi\":\"10.23919/ICEP55381.2022.9795456\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Future Redistribution Layer (RDL) interposer requires low dielectric constant (Dk) and high density RDL layers to improve signal and power integrity in high- performance computing (HPC) application. This paper proposes alkali-developable photo-imageable dielectrics (PID), FG-Series with low Dk of 2.9 at 10GHz, which enable 2μm-via patterning and provide biased high accelerated stress test (b- HAST) resistance on 2μm-L/S Cu traces. FG-series is promising candidates to enable low signal delay, high density and good reliability for RDL interposer.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"103 4\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795456\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795456","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Advanced Low Dk and High-Density Photo- Imageable Dielectrics for RDL Interposer
Future Redistribution Layer (RDL) interposer requires low dielectric constant (Dk) and high density RDL layers to improve signal and power integrity in high- performance computing (HPC) application. This paper proposes alkali-developable photo-imageable dielectrics (PID), FG-Series with low Dk of 2.9 at 10GHz, which enable 2μm-via patterning and provide biased high accelerated stress test (b- HAST) resistance on 2μm-L/S Cu traces. FG-series is promising candidates to enable low signal delay, high density and good reliability for RDL interposer.
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