2014年技术项目委员会

Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2014 Pub Date : 1900-01-01 DOI:10.1109/eosesd.2015.7314749

M. Etherton, Nathan Jack, Shih-Hung Chen, C. Duvvury, Xiaofeng Fan, F. Farbiz, G. Boselli, D. Linten, K. Esmark, Timothy Maloney, M. Mergens, Qpx GmbH, M. Okushima, J. Salcedo, M. Scholz, S. Beebe, G. Hellings, R. Ashton, Fabrice Caignet, Wei Huang, D. Pommerenke, Ankit Srivastava, Richard T. K. Wong, M. Lam, R. Gibson, Victor Cao, A. Salman

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摘要

-vTLP/HBM/MM/CDM设备测试:测试仪，方法和相关问题小组委员会主席:Theo Smedes, NXP Semiconductors Robert Ashton, ON Semiconductor Evan Grund, Grund Technical Solutions, LLC Marty Johnson, Texas Instruments, 1m: David J . Johnson, High Power Pulse Instruments GmbH Tom Meuse, Thermo Fisher S科学Masanori Sawada, HANW A Electronics Wolfgang Stadler, Intel Mobile Communications

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Technical program committee 2014

-vTLP/HBM/MM/CDM Device Testing: Testers, Methods, and Correlation Issues Sub-Committee Chair: Theo Smedes, NXP Semiconductors Robert Ashton, ON Semiconductor Evan Grund, Grund Technical Solutions, LLC Marty Johnson, Texas Instruments, 1m: David J ohnsson, High Power Pulse Instruments GmbH Tom Meuse, Thermo Fisher S cientijic Masanori Sawada, HANW A Electronics Wolfgang Stadler, Intel Mobile Communications

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Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2014

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