集成电路封装过孔与印刷电路板电磁耦合互感器模型的有效性

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Pub Date : 1998-05-25 DOI:10.1109/ECTC.1998.678849

Jin Zhao, J. Fang

{"title":"集成电路封装过孔与印刷电路板电磁耦合互感器模型的有效性","authors":"Jin Zhao, J. Fang","doi":"10.1109/ECTC.1998.678849","DOIUrl":null,"url":null,"abstract":"The procedure of extracting mutual inductor model between vias is demonstrated. Then the validity of the mutual inductor model is studied by comparing the solution from the mutual inductor model with that from the full-wave field simulation. It is found that the valid frequency range of the mutual inductor model is mostly determined by the lowest resonant frequency of the package structure.","PeriodicalId":422475,"journal":{"name":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","volume":"37 2","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Validity of mutual inductor model for electromagnetic coupling between vias in integrated-circuit packages and printed circuit boards\",\"authors\":\"Jin Zhao, J. Fang\",\"doi\":\"10.1109/ECTC.1998.678849\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The procedure of extracting mutual inductor model between vias is demonstrated. Then the validity of the mutual inductor model is studied by comparing the solution from the mutual inductor model with that from the full-wave field simulation. It is found that the valid frequency range of the mutual inductor model is mostly determined by the lowest resonant frequency of the package structure.\",\"PeriodicalId\":422475,\"journal\":{\"name\":\"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)\",\"volume\":\"37 2\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-05-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1998.678849\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1998.678849","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

给出了在过孔间提取互感模型的过程。然后通过与全波场仿真结果的比较，研究了互感模型的有效性。研究发现互感器模型的有效频率范围主要由封装结构的最低谐振频率决定。

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Validity of mutual inductor model for electromagnetic coupling between vias in integrated-circuit packages and printed circuit boards

The procedure of extracting mutual inductor model between vias is demonstrated. Then the validity of the mutual inductor model is studied by comparing the solution from the mutual inductor model with that from the full-wave field simulation. It is found that the valid frequency range of the mutual inductor model is mostly determined by the lowest resonant frequency of the package structure.

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来源期刊

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)

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