基于TSV的三维集成电路非接触式测试存取机制

2013 IEEE 31st VLSI Test Symposium (VTS) Pub Date : 2013-04-29 DOI:10.1109/VTS.2013.6548904

R. Rashidzadeh

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引用次数: 14

摘要

本文介绍了三种用于非接触式TSV探测的耦合技术，并讨论了它们的优缺点。设计并仿真了一种基于电容耦合原理的非接触式无创TSV探测方案。实现的方案支持TSV探测的高密度和小间距要求。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Contactless test access mechanism for TSV based 3D ICs

In this paper, three coupling techniques for contactless TSV probing have been presented and their advantages and disadvantages are discussed. A contactless, noninvasive TSV probing scheme based on the principle of capacitive coupling is designed and simulated. The implemented scheme supports the high-density and the tight-pitch requirements for TSV probing.

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来源期刊

2013 IEEE 31st VLSI Test Symposium (VTS)

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