{"title":"电载荷作用下裂纹尖端电迁移的有限元模拟","authors":"T. Liu","doi":"10.1109/CPEEE56777.2023.10217564","DOIUrl":null,"url":null,"abstract":"This paper deals with the electromigration and associated physics under the electro-thermo-structural-diffusion coupled-field analysis. Using the finite element method, the atomic migration and distribution under the electric load are investigated. As a result, the locations of voids and hillocks can be determined.","PeriodicalId":364883,"journal":{"name":"2023 13th International Conference on Power, Energy and Electrical Engineering (CPEEE)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-02-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Finite Element Simulation of Electromigration near Crack Tip under Electric Load\",\"authors\":\"T. Liu\",\"doi\":\"10.1109/CPEEE56777.2023.10217564\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper deals with the electromigration and associated physics under the electro-thermo-structural-diffusion coupled-field analysis. Using the finite element method, the atomic migration and distribution under the electric load are investigated. As a result, the locations of voids and hillocks can be determined.\",\"PeriodicalId\":364883,\"journal\":{\"name\":\"2023 13th International Conference on Power, Energy and Electrical Engineering (CPEEE)\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-02-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 13th International Conference on Power, Energy and Electrical Engineering (CPEEE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CPEEE56777.2023.10217564\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 13th International Conference on Power, Energy and Electrical Engineering (CPEEE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CPEEE56777.2023.10217564","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Finite Element Simulation of Electromigration near Crack Tip under Electric Load
This paper deals with the electromigration and associated physics under the electro-thermo-structural-diffusion coupled-field analysis. Using the finite element method, the atomic migration and distribution under the electric load are investigated. As a result, the locations of voids and hillocks can be determined.