采用模型降阶技术的PCB模拟器分析电源/地平面

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967615

H. Kubota, A. Kamo, T. Watanabe, H. Asai

{"title":"采用模型降阶技术的PCB模拟器分析电源/地平面","authors":"H. Kubota, A. Kamo, T. Watanabe, H. Asai","doi":"10.1109/EPEP.2001.967615","DOIUrl":null,"url":null,"abstract":"With the progress of integration of circuits and PCBs (printed circuit boards), novel techniques have been required for verification of signal integrity. Noise analysis of the power/ground planes is one of the most important issues. This paper describes a high-speed simulator for PCBs which contain interconnects with nonlinear terminations. This simulator is based on the ASSIST environmental tool constructed for development of the circuit simulators, and is combined with PRIMA (passive reduced-order interconnect macromodeling algorithm). In this simulator, an efficient implementation of PRIMA is considered with use of a voltage-controlled current source (VCCS) model. Finally, this simulator is applied to the analysis of power/ground planes of simple PCBs, and the validity is verified.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"39 2-3","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Analysis of power/ground planes by PCB simulator with model order reduction technique\",\"authors\":\"H. Kubota, A. Kamo, T. Watanabe, H. Asai\",\"doi\":\"10.1109/EPEP.2001.967615\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With the progress of integration of circuits and PCBs (printed circuit boards), novel techniques have been required for verification of signal integrity. Noise analysis of the power/ground planes is one of the most important issues. This paper describes a high-speed simulator for PCBs which contain interconnects with nonlinear terminations. This simulator is based on the ASSIST environmental tool constructed for development of the circuit simulators, and is combined with PRIMA (passive reduced-order interconnect macromodeling algorithm). In this simulator, an efficient implementation of PRIMA is considered with use of a voltage-controlled current source (VCCS) model. Finally, this simulator is applied to the analysis of power/ground planes of simple PCBs, and the validity is verified.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"39 2-3\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967615\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967615","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

随着电路和印刷电路板集成技术的发展，对信号完整性的验证提出了新的要求。电源/地平面的噪声分析是最重要的问题之一。本文介绍了一种用于包含非线性终端互连的pcb的高速模拟器。该仿真器基于为开发电路仿真器而构建的ASSIST环境工具，并结合PRIMA(无源降阶互连宏建模算法)。在这个模拟器中，考虑了使用电压控制电流源(VCCS)模型来有效地实现PRIMA。最后，将该仿真器应用于简单pcb的电源/地平面分析，验证了该仿真器的有效性。

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Analysis of power/ground planes by PCB simulator with model order reduction technique

With the progress of integration of circuits and PCBs (printed circuit boards), novel techniques have been required for verification of signal integrity. Noise analysis of the power/ground planes is one of the most important issues. This paper describes a high-speed simulator for PCBs which contain interconnects with nonlinear terminations. This simulator is based on the ASSIST environmental tool constructed for development of the circuit simulators, and is combined with PRIMA (passive reduced-order interconnect macromodeling algorithm). In this simulator, an efficient implementation of PRIMA is considered with use of a voltage-controlled current source (VCCS) model. Finally, this simulator is applied to the analysis of power/ground planes of simple PCBs, and the validity is verified.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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