Chenxi Huang, Biyao Zhao, K. Shringarpure, S. Bai, X. Fang, T. Makharashvili, Hanqin Ye, Y. S. Cao, M. Cracraft, M. Cocchini, S. Connor, Q. Gaumer, S. Scearce, B. Archambeault, B. Achkir, E. Li, Lijun Jiang, A. Ruehli, J. Fan, J. Drewniak
{"title":"基于物理设计的电源完整性与电压纹波谱分解","authors":"Chenxi Huang, Biyao Zhao, K. Shringarpure, S. Bai, X. Fang, T. Makharashvili, Hanqin Ye, Y. S. Cao, M. Cracraft, M. Cocchini, S. Connor, Q. Gaumer, S. Scearce, B. Archambeault, B. Achkir, E. Li, Lijun Jiang, A. Ruehli, J. Fan, J. Drewniak","doi":"10.1109/ISEMC.2016.7571666","DOIUrl":null,"url":null,"abstract":"A decomposition method for the PCB PDN voltage ripple caused by the IC switching current is developed based on an equivalent circuit model from a cavity model. The decomposition is presented both in frequency domain and time domain. Along with this decomposition approach, a one-to-one correspondence between the voltage ripple and the geometry is revealed. Guidelines to decrease the PCB PDN voltage ripple is also discussed and corroborated by both simulation and analytical calculation.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"63 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Power integrity with voltage ripple spectrum decomposition for physics-based design\",\"authors\":\"Chenxi Huang, Biyao Zhao, K. Shringarpure, S. Bai, X. Fang, T. Makharashvili, Hanqin Ye, Y. S. Cao, M. Cracraft, M. Cocchini, S. Connor, Q. Gaumer, S. Scearce, B. Archambeault, B. Achkir, E. Li, Lijun Jiang, A. Ruehli, J. Fan, J. Drewniak\",\"doi\":\"10.1109/ISEMC.2016.7571666\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A decomposition method for the PCB PDN voltage ripple caused by the IC switching current is developed based on an equivalent circuit model from a cavity model. The decomposition is presented both in frequency domain and time domain. Along with this decomposition approach, a one-to-one correspondence between the voltage ripple and the geometry is revealed. Guidelines to decrease the PCB PDN voltage ripple is also discussed and corroborated by both simulation and analytical calculation.\",\"PeriodicalId\":326016,\"journal\":{\"name\":\"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)\",\"volume\":\"63 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2016.7571666\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2016.7571666","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Power integrity with voltage ripple spectrum decomposition for physics-based design
A decomposition method for the PCB PDN voltage ripple caused by the IC switching current is developed based on an equivalent circuit model from a cavity model. The decomposition is presented both in frequency domain and time domain. Along with this decomposition approach, a one-to-one correspondence between the voltage ripple and the geometry is revealed. Guidelines to decrease the PCB PDN voltage ripple is also discussed and corroborated by both simulation and analytical calculation.