{"title":"坚固的45纳米多孔低k工艺集成与良好控制等离子体过程损伤和水分吸收","authors":"N. Matsunaga","doi":"10.1109/ICICDT.2006.220804","DOIUrl":null,"url":null,"abstract":"In this paper, robust 45nm porous low-k process integration with well-controlled plasma process damage and moisture uptake will be discussed","PeriodicalId":447050,"journal":{"name":"2006 IEEE International Conference on IC Design and Technology","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-08-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Robust 45nm porous low-k process integration with well-controlled plasma process damage and moisture uptake\",\"authors\":\"N. Matsunaga\",\"doi\":\"10.1109/ICICDT.2006.220804\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, robust 45nm porous low-k process integration with well-controlled plasma process damage and moisture uptake will be discussed\",\"PeriodicalId\":447050,\"journal\":{\"name\":\"2006 IEEE International Conference on IC Design and Technology\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-08-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 IEEE International Conference on IC Design and Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICICDT.2006.220804\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 IEEE International Conference on IC Design and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICICDT.2006.220804","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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