表面充电对AlGaN/GaN hemt电流稳定性的影响

K. Nishiguchi, T. Hashizume
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引用次数: 1

摘要

利用双栅晶体管结构,我们评估了非偏置应力在AlGaN/GaN表面空间诱导的表面充电的影响。漏极通路上的脉冲电压应力只导致导通电阻增加,而源区上的应力还会降低饱和漏极电流。此外,在接入区域显著的表面充电导致阈值电压偏移。二维电势模拟表明,表面负电荷调节栅极边缘附近的电势分布。这种表面充注可以从应力浇口边缘延伸到0.5 μm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Surface charging effects on current stability of AlGaN/GaN HEMTs
Using a dual-gate transistor structure, we have evaluated the effect of off-bias-stress spatially induced surface charging at the AlGaN/GaN surface. Pulsed voltage stress on the drain access region led only to increase in the on-resistance, whereas the stress on the source region additionally decreased the saturation drain current. In addition, significant surface charging in the access region resulted in a threshold voltage shift. The 2D potential simulation indicated that surface negative charges modulate the potential distribution near the gate edge. It was also found that such surface charging can extend as far as 0.5 μm from the stressing gate edge.
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