{"title":"电力电子封装中基于tsv电感器的研制","authors":"Saikat Mondal, J. Gamboa, Bruce C. Kim","doi":"10.1109/ICEPT.2015.7236663","DOIUrl":null,"url":null,"abstract":"This paper describes the design of a Through-Silicon-Via (TSV) based high-density 3D toroidal type inductor with two different ferromagnetic materials (nickel and Ni-Zn-ferrite) in the core. 3D inductors with different structural dimensions are simulated and compared.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"40 6","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Development of TSV-based inductors in power electronics packaging\",\"authors\":\"Saikat Mondal, J. Gamboa, Bruce C. Kim\",\"doi\":\"10.1109/ICEPT.2015.7236663\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the design of a Through-Silicon-Via (TSV) based high-density 3D toroidal type inductor with two different ferromagnetic materials (nickel and Ni-Zn-ferrite) in the core. 3D inductors with different structural dimensions are simulated and compared.\",\"PeriodicalId\":415934,\"journal\":{\"name\":\"2015 16th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"40 6\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-09-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 16th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2015.7236663\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2015.7236663","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Development of TSV-based inductors in power electronics packaging
This paper describes the design of a Through-Silicon-Via (TSV) based high-density 3D toroidal type inductor with two different ferromagnetic materials (nickel and Ni-Zn-ferrite) in the core. 3D inductors with different structural dimensions are simulated and compared.
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