IGBT电源模块电热建模新方法

Bipolar/BiCMOS Circuits and Technology, 2004. Proceedings of the 2004 Meeting Pub Date : 2004-12-13 DOI:10.1109/BIPOL.2004.1365805

L. Mussard, P. Tounsi, P. Austin, J.-M. DorkeI, E. Antonini

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引用次数: 4

摘要

本文提出了一种新颖的电热模拟方法。其创新之处在于三维热建模与igbt芯片电模型之间有效的沟通方式。该方法以IGBT模块为例。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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New clectro-thermal modeling method for IGBT power module

In this paper, an original method for electro-thermal simulation is presented. The originality lies in the effective way of communication between 3D thermal modeling and IGBT-chip electrical model. This method is illustrated by IGBT modules.

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来源期刊

Bipolar/BiCMOS Circuits and Technology, 2004. Proceedings of the 2004 Meeting

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