{"title":"光纤光栅传感器模块性能评估","authors":"J. Hao, Z. Cai, Y. Gong, M. Yee","doi":"10.1109/LEOS.2007.4382365","DOIUrl":null,"url":null,"abstract":"A method to estimate FBG sensor module performance is presented. Both temperature effect and stress effect on bare and packaged FBG sensors have been addressed theoretically and experimentally with good agreement.","PeriodicalId":110592,"journal":{"name":"LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings","volume":"101 3-4","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"FBG Sensor Module Performance Estimation\",\"authors\":\"J. Hao, Z. Cai, Y. Gong, M. Yee\",\"doi\":\"10.1109/LEOS.2007.4382365\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A method to estimate FBG sensor module performance is presented. Both temperature effect and stress effect on bare and packaged FBG sensors have been addressed theoretically and experimentally with good agreement.\",\"PeriodicalId\":110592,\"journal\":{\"name\":\"LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings\",\"volume\":\"101 3-4\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LEOS.2007.4382365\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LEOS.2007.4382365","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A method to estimate FBG sensor module performance is presented. Both temperature effect and stress effect on bare and packaged FBG sensors have been addressed theoretically and experimentally with good agreement.