1.7kV沟槽IGBT,采用深层独立浮动p层设计,具有低损耗、低EMI噪声、高可靠性等特点

So Watanabe, M. Mori, Taiga Arai, K. Ishibashi, Y. Toyoda, T. Oda, T. Harada, K. Saito
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引用次数: 22

摘要

为了实现低损耗、低电磁干扰噪声和高可靠性,研制了一种新型的1.7kV IGBT。将浮动p层与沟槽栅极分离可以减少多余的VGE超调,从而使反向恢复dVAK/dt比传统IGBT小51%。深浮p层削弱了沟槽下的电场,产生2250V的雪崩击穿电压。此外,该结构的Eon + Eoff比传统结构降低了47%,在125°C时保持2.3V的低VCE(sat)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
1.7kV trench IGBT with deep and separate floating p-layer designed for low loss, low EMI noise, and high reliability
A novel 1.7kV IGBT with deep floating-p layers separated from trench gates has been developed to realize low loss, low EMI noise, and high reliability. Separating floating-p layers from the trench gates reduces excess VGE overshoot, which results in a 51% smaller reverse recovery dVAK/dt than the conventional IGBT. The deep floating p-layers weaken the electric field under the trenches, which results in an avalanche breakdown voltage of 2250V. In addition, the Eon + Eoff for the proposed structure can be reduced by 47% more than that of the conventional one, maintaining a low VCE(sat) of 2.3V at 125°C.
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