So Watanabe, M. Mori, Taiga Arai, K. Ishibashi, Y. Toyoda, T. Oda, T. Harada, K. Saito
{"title":"1.7kV沟槽IGBT,采用深层独立浮动p层设计,具有低损耗、低EMI噪声、高可靠性等特点","authors":"So Watanabe, M. Mori, Taiga Arai, K. Ishibashi, Y. Toyoda, T. Oda, T. Harada, K. Saito","doi":"10.1109/ISPSD.2011.5890787","DOIUrl":null,"url":null,"abstract":"A novel 1.7kV IGBT with deep floating-p layers separated from trench gates has been developed to realize low loss, low EMI noise, and high reliability. Separating floating-p layers from the trench gates reduces excess V<inf>GE</inf> overshoot, which results in a 51% smaller reverse recovery dV<inf>AK</inf>/dt than the conventional IGBT. The deep floating p-layers weaken the electric field under the trenches, which results in an avalanche breakdown voltage of 2250V. In addition, the E<inf>on</inf> + E<inf>off</inf> for the proposed structure can be reduced by 47% more than that of the conventional one, maintaining a low V<inf>CE(sat)</inf> of 2.3V at 125°C.","PeriodicalId":132504,"journal":{"name":"2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs","volume":"132 8","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"22","resultStr":"{\"title\":\"1.7kV trench IGBT with deep and separate floating p-layer designed for low loss, low EMI noise, and high reliability\",\"authors\":\"So Watanabe, M. Mori, Taiga Arai, K. Ishibashi, Y. Toyoda, T. Oda, T. Harada, K. Saito\",\"doi\":\"10.1109/ISPSD.2011.5890787\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel 1.7kV IGBT with deep floating-p layers separated from trench gates has been developed to realize low loss, low EMI noise, and high reliability. Separating floating-p layers from the trench gates reduces excess V<inf>GE</inf> overshoot, which results in a 51% smaller reverse recovery dV<inf>AK</inf>/dt than the conventional IGBT. The deep floating p-layers weaken the electric field under the trenches, which results in an avalanche breakdown voltage of 2250V. In addition, the E<inf>on</inf> + E<inf>off</inf> for the proposed structure can be reduced by 47% more than that of the conventional one, maintaining a low V<inf>CE(sat)</inf> of 2.3V at 125°C.\",\"PeriodicalId\":132504,\"journal\":{\"name\":\"2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs\",\"volume\":\"132 8\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"22\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.2011.5890787\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2011.5890787","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
1.7kV trench IGBT with deep and separate floating p-layer designed for low loss, low EMI noise, and high reliability
A novel 1.7kV IGBT with deep floating-p layers separated from trench gates has been developed to realize low loss, low EMI noise, and high reliability. Separating floating-p layers from the trench gates reduces excess VGE overshoot, which results in a 51% smaller reverse recovery dVAK/dt than the conventional IGBT. The deep floating p-layers weaken the electric field under the trenches, which results in an avalanche breakdown voltage of 2250V. In addition, the Eon + Eoff for the proposed structure can be reduced by 47% more than that of the conventional one, maintaining a low VCE(sat) of 2.3V at 125°C.