InGaAs/InP p-I-n测试结构的模型校准

A. Walker, O. Pitts, C. Storey, P. Waldron
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引用次数: 0

摘要

在室温下,使用不同区域的保护测试结构对InGaAs/InP双异质结构p-I-n结进行了数值装置模型校准,并研究了少数载流子扩散、耗尽区产生和周长(分流)泄漏的贡献。周长泄漏确定为0.5 pA/cm,而耗尽区贡献2.2 nA/cm2;通过保护环排除了总体扩散贡献,但可以解析计算为2.0 nA/cm2。通过对扩散长度和SRH寿命的标定,在数值模拟环境下对实验测试结构进行精确再现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Model Calibration of InGaAs/InP p-I-n Test Structures
Numerical device model calibration of InGaAs/InP double-heterostructure p-I-n junctions is performed at room temperature using guarded test structures of various areas and investigating the contributions from minority carrier diffusion, depletion region generation and finally perimeter (shunt) leakage. The perimeter leakage is determined to be 0.5 pA/cm, whereas the depletion region contributes 2.2 nA/cm2; the bulk diffusion contribution is excluded via the guard ring but can be computed analytically to be 2.0 nA/cm2. Reproducing the experimental test structures within the numerical modeling environment accurately reproduces the data based on calibrating the diffusion length and SRH lifetime.
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