不同物理效应在UDSM MOSFET的延迟和功率估计:综述

A. Singh, J. Samanta
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引用次数: 4

摘要

短沟道效应是MOS栅极长度减小的主要原因,特别是栅极长度小于0.1μm。本文对近十年来不同研究人员提出的时延和功率估计的各种二次效应及其解决方法进行了简要的综述。对栅极直接隧道电流(GDTC)、栅极感应漏极(GIDL)、带对带隧道电流(BTBT)、负偏置温度不稳定性(NBTI)、多晶硅栅极耗尽效应、速度饱和、反向短通道效应(RSCE)、衬底电流感应体效应(SCBE)、STI应力效应和体电荷效应等不同效应进行了清晰的解释,并基本描述了它们在CMOS器件超深亚微米区域的解决技术。本文将从不同的研究人员那里获得一些仿真和实验结果,并解释这些效应与不同的MOS模型参数之间的关系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Different physical effects in UDSM MOSFET for delay & power estimation: A review
Short-channel effects play a major role for MOS scaling of gate length down and especially below 0.1μm or even less. In this paper, the detail review of different secondary effects and their solutions for delay & power estimation which are proposed by various researchers in the past decade are presented briefly. Different effects like Gate Direct Tunneling Current (GDTC), Gate-Induced Drain Leakage (GIDL), Band-to-Band Tunneling Currents (BTBT), Negative Bias Temperature Instability (NBTI), Polysilicon-Gate Depletion Effects, Velocity Saturation, Reverse Short Channel Effect (RSCE), Substrate Current Induced Body Effect (SCBE), STI Stress Effect and Bulk Charge Effect etc are clearly explained and also described their solution techniques basically in ultra deep submicron region of CMOS devices. Some simulation & experiments results are taken from different researchers which will be explained, how these effects are related to different MOS model parameters.
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