一款31 dbm高坚固性功率放大器,采用65nm标准CMOS,具有高效堆叠级联

S. Leuschner, S. Pinarello, U. Hodel, Jan-Erik Mueller, H. Klar
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引用次数: 27

摘要

提出了一种基于65纳米CMOS技术的新型高坚固性功率放大器拓扑结构。所提出的堆叠级联编码拓扑仅使用现代三阱CMOS工艺中可用的标准器件来实现超过18V的击穿电压。功率放大器级提供28 dBm输出功率,功率附加效率(PAE)为69.9%,电源为3.6V。饱和增益为18 dB。提出了一种输出功率为31 dbm、PAE为61%的GSM低频段功率放大器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 31-dBm, high ruggedness power amplifier in 65-nm standard CMOS with high-efficiency stacked-cascode stages
A novel, high ruggedness power amplifier topology in a 65-nm CMOS technology is proposed. The proposed stacked cascode topology uses only standard devices available in a modern triple-well CMOS process to achieve breakdown voltages of more than 18V. The power amplifier stage delivers 28 dBm output power at a power-added efficiency (PAE) of 69.9% from a 3.6V supply. The saturation gain is 18 dB. A watt-level power amplifier for GSM low-band operation with 31-dBm output power and 61% PAE is presented.
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