IEEE 802.11 b/g基带芯片的设计、实现和测试

Yuzhong Jiao, Xin'an Wang, Gaofa Xiao, Hongying Chen
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引用次数: 1

摘要

相互兼容的IEEE 802.11 b和g标准结合在一起,提供具有更多数据速率选择的高性能无线通信。为了满足802.11标准和其他以DSSS和OFDM作为物理层部分关键算法的标准的升级需求,采用SOC(或ASIC+DSP)方案实现基带系统。本文首先介绍了802.11 b/g物理层的特点,然后给出了采用中芯国际0.18微米工艺设计并封装的芯片BX501的结构和布局。最后给出了测试结果,证明该芯片能够满足802.11 b/g物理层的调制/解调功能。最后,得出结论,指出系统级验证的重要性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design, implementation and testing of an IEEE 802.11 b/g baseband chip
IEEE 802.11 b and g standards, which are compatible with each other, are combined to provide higher-performance wireless communication with more options of data rates. In order to meet the upgrading demands of 802.11 standards and other standards using DSSS and OFDM as the pivotal algorithms of physical-layer parts, a SOC (or ASIC+DSP) solution is used to realize the baseband system. The paper firstly introduces the features of the 802.11 b/g PHY, and then gives the architecture and layout of BX501, the chip designed and taped out in SMIC 0.18-micron technology. The paper also presents the testing results that prove the chip can fulfill the modulation/demodulation functions of the 802.11 b/g PHY. At last, a conclusion is made that points out the importance of system-level verification.
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