{"title":"重掺杂多晶硅的电迁移失效","authors":"M. Polcari, J. Lloyd, S. Cvikevich","doi":"10.1109/IRPS.1980.362936","DOIUrl":null,"url":null,"abstract":"Electromigration induced failures have been observed in both n & p doped polycrystalline silicon conductors. The location of the failure sites was found to depend upon the sign of the charge carrier. Migration of the dopant was identified as the failure mechanism.","PeriodicalId":270567,"journal":{"name":"18th International Reliability Physics Symposium","volume":"7 21","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1980-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Electromigration Failure in Hieavily Doped Polycrystalline Silicon\",\"authors\":\"M. Polcari, J. Lloyd, S. Cvikevich\",\"doi\":\"10.1109/IRPS.1980.362936\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Electromigration induced failures have been observed in both n & p doped polycrystalline silicon conductors. The location of the failure sites was found to depend upon the sign of the charge carrier. Migration of the dopant was identified as the failure mechanism.\",\"PeriodicalId\":270567,\"journal\":{\"name\":\"18th International Reliability Physics Symposium\",\"volume\":\"7 21\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1980-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"18th International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1980.362936\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"18th International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1980.362936","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electromigration Failure in Hieavily Doped Polycrystalline Silicon
Electromigration induced failures have been observed in both n & p doped polycrystalline silicon conductors. The location of the failure sites was found to depend upon the sign of the charge carrier. Migration of the dopant was identified as the failure mechanism.