{"title":"紫外线/臭氧清洗防止铝垫腐蚀","authors":"Seung-Ho Ahn, T. Cho, Yoon-Soo Kim, S. Oh","doi":"10.1109/ECTC.1996.517380","DOIUrl":null,"url":null,"abstract":"One of the methods to prevent the moisture concentration, which can promote the corrosion of aluminum is to remove the space around the aluminum bonding pad. In other words, the perfect adhesion without delamination between the integrated circuit chip and the molding compound would not allow the electrolyte formation, and the aluminum pad corrosion. UV/ozone cleaning of the chip was thought to be able to strengthen the chip-molding compound adhesion. In this work, the effectiveness of UV/ozone cleaning in the prevention of aluminum pad corrosion, and the relationship between the delamination and the corrosion were investigated.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"17 4","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Prevention of aluminum pad corrosion by UV/ozone cleaning\",\"authors\":\"Seung-Ho Ahn, T. Cho, Yoon-Soo Kim, S. Oh\",\"doi\":\"10.1109/ECTC.1996.517380\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"One of the methods to prevent the moisture concentration, which can promote the corrosion of aluminum is to remove the space around the aluminum bonding pad. In other words, the perfect adhesion without delamination between the integrated circuit chip and the molding compound would not allow the electrolyte formation, and the aluminum pad corrosion. UV/ozone cleaning of the chip was thought to be able to strengthen the chip-molding compound adhesion. In this work, the effectiveness of UV/ozone cleaning in the prevention of aluminum pad corrosion, and the relationship between the delamination and the corrosion were investigated.\",\"PeriodicalId\":143519,\"journal\":{\"name\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"volume\":\"17 4\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1996.517380\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 Proceedings 46th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1996.517380","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Prevention of aluminum pad corrosion by UV/ozone cleaning
One of the methods to prevent the moisture concentration, which can promote the corrosion of aluminum is to remove the space around the aluminum bonding pad. In other words, the perfect adhesion without delamination between the integrated circuit chip and the molding compound would not allow the electrolyte formation, and the aluminum pad corrosion. UV/ozone cleaning of the chip was thought to be able to strengthen the chip-molding compound adhesion. In this work, the effectiveness of UV/ozone cleaning in the prevention of aluminum pad corrosion, and the relationship between the delamination and the corrosion were investigated.
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