如何确定正常铝键板上的氟污染水平?

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2019-07-01 DOI:10.1109/IPFA47161.2019.8984826

H. Younan

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引用次数: 0

摘要

在我们之前的论文中，我们讨论了EDS和AES的区别，并得出EDS不能用于测定A Normal Al键垫上的F电平的结论。本文将讨论如何确定普通铝键合板上的氟污染水平，并提出使用AES/XPS分析晶圆制造中普通铝键合板上的氟污染水平。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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How To Determine Fluorine Contamination Level On A Normal Al Bondpad?

IN our previous paper, we discussed the differences between EDS and AES and concluded that EDS couldn’t be used to determine F level on A Normal Al bondpad. In this paper, we will discuss how we can determine fluorine contamination level on a normal Al bondpad and propose to use AES/XPS to analyse fluorine level on a normal Al bondpad in wafer fabrication.

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来源期刊

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)

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